Invention Grant
- Patent Title: Optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip
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Application No.: US16462483Application Date: 2017-12-18
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Publication No.: US10833224B2Publication Date: 2020-11-10
- Inventor: Fabian Kopp , Attila Molnar
- Applicant: OSRAM OLED GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@73f1202f
- International Application: PCT/EP2017/083317 WO 20171218
- International Announcement: WO2018/114807 WO 20180628
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L33/14 ; H01L33/40 ; H01L33/46 ; H01L33/06 ; H01L33/30

Abstract:
An optoelectronic semiconductor chip includes a contact layer that impresses current directly into a first semiconductor region present in direct contact with a current web, the first semiconductor region is an n-side and a second semiconductor region is a p-side of a semiconductor layer sequence, and a second mirror layer is applied directly to a second semiconductor region, a plurality of contact fields and isolator fields are arranged alternately along a longitudinal direction of the current web, in the contact fields, the contact layer is in direct contact with the current web, and the isolator fields are free of the contact layer, and a first mirror layer is located between the current web and the first semiconductor region.
Public/Granted literature
- US20190371969A1 OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD OF PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR CHIP Public/Granted day:2019-12-05
Information query
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