Invention Grant
- Patent Title: LED light system having elastomeric encapsulation
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Application No.: US15643861Application Date: 2017-07-07
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Publication No.: US10854796B2Publication Date: 2020-12-01
- Inventor: Adikaramge Asiri Jayawardena , Andrew Francis Scarlata
- Applicant: Eaton Intelligent Power Limited
- Assignee: Eaton Intelligent Power Limited
- Current Assignee: Eaton Intelligent Power Limited
- Agency: Merchant & Gould P.C.
- Main IPC: H01L33/56
- IPC: H01L33/56 ; H01L33/54 ; H01L33/62 ; H01L33/64 ; F21V23/00 ; F21V31/00 ; H05K1/02 ; F21V29/74 ; H05K3/28 ; H01L25/075 ; F21V29/77 ; F21Y115/10 ; F21K9/90
Abstract:
A light system includes a first substrate and a second substrate having the first substrate thereon. A light emitting diode (LED) is connected to the first substrate. An encapsulation layer covers the LED and at least a majority of the first substrate.
Public/Granted literature
- US20180013041A1 LED LIGHT SYSTEM Public/Granted day:2018-01-11
Information query
IPC分类:
