A microrobot assembly system includes a substrate containing conductive traces formed into at least one holding zone and one moving zone, a diamagnetic layer on the substrate, at least two magnetic structures movable across the diamagnetic layer in response to voltages applied to the conductive traces, wherein the holding zone holds one of the magnetic structures and the moving zone allows another of the magnetic structures to attach to the magnetic structure being held. The system may include a plate spaced above the substrate and rails to guide the moving magnetic structures.