Invention Grant
- Patent Title: Method of pattern data preparation and method of forming pattern in layer
-
Application No.: US16143419Application Date: 2018-09-26
-
Publication No.: US10861673B2Publication Date: 2020-12-08
- Inventor: Chien-Ying Sun , En-Chiuan Liou , Yu-Cheng Tung
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW107131481A 20180907
- Main IPC: H01J37/302
- IPC: H01J37/302 ; H01J37/317 ; H01L21/027

Abstract:
A method of pattern data preparation includes the following steps. A desired pattern to be formed on a surface of a layer is inputted. A first set of beam shots are determined, and a first calculated pattern on the surface is calculated from the first set of beam shots. The first calculated pattern is rotated, so that a boundary of the desired pattern corresponding to a non-smooth boundary of the first calculated pattern is parallel to a boundary constituted by beam shots. A second set of beam shots are determined to revise the non-smooth boundary of the first calculated pattern, thereby calculating a second calculated pattern being close to the desired pattern on the surface. The present invention also provides a method of forming a pattern in a layer.
Public/Granted literature
- US20200083020A1 METHOD OF PATTERN DATA PREPARATION AND METHOD OF FORMING PATTERN IN LAYER Public/Granted day:2020-03-12
Information query