Invention Grant
- Patent Title: Electronic package carrier structure thereof, and method for fabricating the carrier structure
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Application No.: US16669872Application Date: 2019-10-31
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Publication No.: US10863626B1Publication Date: 2020-12-08
- Inventor: Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW108131538A 20190902
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/18 ; H05K3/46 ; H05K1/02
Abstract:
A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.
Information query
