A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a polymerizable compound (a1) on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a polymerizable compound (a2) dropwise discretely onto the curable composition (A1) layer, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) except a solvent has a viscosity at 25° C. of 40 mPa·s or more and less than 500 mPa·s. The curable composition (A2) except a solvent has a viscosity at 25° C. of 1 mPa·s or more and less than 40 mPa·s.