Invention Grant
- Patent Title: Semiconductor package
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Application No.: US16430365Application Date: 2019-06-03
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Publication No.: US10886223B2Publication Date: 2021-01-05
- Inventor: Chun-Jun Zhuang , Hsu-Nan Fang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/528 ; H01L23/31 ; H01L23/00 ; H01L25/065
Abstract:
A semiconductor package includes a redistribution layer (RDL) structure, a first die, a molding compound and an interconnect structure. The first die is disposed on the RDL structure. The molding compound is disposed on the RDL structure. The interconnect structure electrically connects the first die to the RDL structure.
Public/Granted literature
- US20200381359A1 SEMICONDUCTOR PACKAGE Public/Granted day:2020-12-03
Information query
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