An antenna package structure comprises a substrate with a first surface and a second surface; a dielectric layer, disposed on the first surface of the substrate comprises at least a impedance matching structure and an interconnection structure; a molding layer, disposed on the dielectric layer comprises a plurality of chips wherein a control chip electrically connects to the impedance matching structure and a plurality of conducting structures; an antenna layer, disposed on the second surface of the substrate comprising at least an antenna electrically connects to the substrate; and a protection layer covers the antenna layer.