Invention Grant
- Patent Title: Average-density-adjustable structure, and material change and selective bonding process using same
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Application No.: US15739445Application Date: 2016-06-27
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Publication No.: US10888839B2Publication Date: 2021-01-12
- Inventor: Jung Bae Kim , Ju Sang Yang , In Seon Lee , Han Sol Kim , Jong Seong Yim
- Applicant: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
- Applicant Address: KR Seoul
- Assignee: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
- Current Assignee: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
- Current Assignee Address: KR Seoul
- Agency: Hultquist, PLLC
- Agent Steven J. Hultquist
- Priority: KR10-2015-0090710 20150625,KR10-2015-0091304 20150626,KR10-2015-0091306 20150626,KR10-2016-0066412 20160530
- International Application: PCT/KR2016/006864 WO 20160627
- International Announcement: WO2016/209063 WO 20161229
- Main IPC: C12M1/09
- IPC: C12M1/09 ; B01D15/00 ; B01J20/26 ; B01J20/28 ; B01J20/32 ; B01J31/00 ; B01D53/86 ; C02F3/34 ; B01D53/02 ; C12N11/08 ; C02F103/08

Abstract:
The present invention relates to an average-density-adjustable structure and more specifically provides a structure the average density of which is adjusted by changing the material of the structure and the size of a void formed therein and which can thereby float on the surface of or in a liquid and can easily bond with or change a material present in a gas or liquid by being equipped with a first material, which is one among an organic catalyst, an inorganic catalyst, a microorganism, and a biomolecule.
Public/Granted literature
- US20180185818A1 AVERAGE-DENSITY-ADJUSTABLE STRUCTURE, AND MATERIAL CHANGE AND SELECTIVE BONDING PROCESS USING SAME Public/Granted day:2018-07-05
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