Invention Grant
- Patent Title: Solid-state image sensor
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Application No.: US16432504Application Date: 2019-06-05
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Publication No.: US10910425B2Publication Date: 2021-02-02
- Inventor: Kazuto Yamamoto , Yo Sakata
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Taito-ku
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Taito-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2016-235840 20161205
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G02B5/10 ; H04N9/07 ; H04N5/369

Abstract:
A solid-state image sensor including a semiconductor layer having a light incident side, a support substrate positioned on an opposite side of the light incident side of the semiconductor layer, photoelectric conversion elements formed two-dimensionally in the semiconductor layer, light reflection structures formed on a surface of the support substrate which faces toward the semiconductor layer, and positioned such that the light reflection structures face the photoelectric conversion elements, respectively, and an interlayer insulating layer formed between adjacent ones of the light reflection structures. The light reflection structures include a light transmission layer and a reflective metal that covers a surface of the light transmission layer opposite to a surface facing the semiconductor layer, and the reflective metal has a concave curved surface facing the photoelectric conversion elements.
Public/Granted literature
- US20190312075A1 SOLID-STATE IMAGE SENSOR Public/Granted day:2019-10-10
Information query
IPC分类: