Invention Grant
- Patent Title: Temperature sensing and fault detection for paralleled double-side cooled power modules
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Application No.: US15871661Application Date: 2018-01-15
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Publication No.: US10916931B2Publication Date: 2021-02-09
- Inventor: Tomas Manuel Reiter , Tom Roewe , Inpil Yoo
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H02H5/04
- IPC: H02H5/04 ; H01L23/473 ; H02M1/32 ; G01N25/72 ; G05B15/02 ; H01L25/10 ; H05K7/20 ; H01L23/373

Abstract:
In accordance with an embodiment, a method includes: monitoring a temperature difference between two double-side cooled (DSC) power modules of a plurality of DSC power modules arranged in stacks of DSC power modules; comparing the temperature difference with a first temperature threshold; detecting a cooling pipe system blockage when the temperature difference is above the first temperature threshold; and after detecting the cooling pipe system blockage, disabling gate driver circuits coupled to the plurality of DSC power modules or operating the DSC power modules in a low-power mode. Each stack includes a plurality of DSC power modules. Each DSC power module has a top surface and a bottom surface, which are each thermally coupled with one or more cooling channels of a cooling pipe system. The two DSC power modules are thermally coupled with a same cooling channel of the one or more cooling channels.
Public/Granted literature
- US20190222018A1 Temperature Sensing and Fault Detection for Paralleled Double-Side Cooled Power Modules Public/Granted day:2019-07-18
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