Invention Grant
- Patent Title: Expandable interbody implant with lordosis correction
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Application No.: US15599638Application Date: 2017-05-19
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Publication No.: US10940018B2Publication Date: 2021-03-09
- Inventor: Amir Ali Sharifi-Mehr , Oliver Buchert
- Applicant: Howmedica Osteonics Corp.
- Applicant Address: US NJ Mahwah
- Assignee: Howmedica Osteonics Corp.
- Current Assignee: Howmedica Osteonics Corp.
- Current Assignee Address: US NJ Mahwah
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61F2/46 ; A61F2/30 ; A61F2/48

Abstract:
A spinal implant for placement between vertebral bodies includes a first member for engaging one of the vertebral bodies, a second member for engaging an opposing one of the vertebral bodies, and at least one extendable support element for inducing movement of the entire first member away from the second member. The first member is connected to the second member such that the first member moves away from the second member by a larger distance at a first end of the implant than at a second end of the implant. A connecting member may connect the first and second members together at the second end of the implant. The connecting member may include one or more rotatable linkages, or the connecting member may be an extension of one of the first and second members slidably received within a track defined within the other of the first and second members.
Public/Granted literature
- US20170333199A1 EXPANDABLE INTERBODY IMPLANT WITH LORDOSIS CORRECTION Public/Granted day:2017-11-23
Information query
IPC分类: