Invention Grant
- Patent Title: Fabrication of a pair of vertical fin field effect transistors having a merged top source/drain
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Application No.: US16779048Application Date: 2020-01-31
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Publication No.: US10964602B2Publication Date: 2021-03-30
- Inventor: Kangguo Cheng , Xin Miao , Wenyu Xu , Chen Zhang
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Kurt Goudy
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/8234 ; H01L21/762 ; H01L29/78 ; H01L29/66 ; H01L29/08 ; H01L27/088 ; H01L27/12 ; H01L29/417 ; H01L29/10

Abstract:
A method of fabricating a vertical fin field effect transistor with a merged top source/drain, including, forming a source/drain layer at the surface of a substrate, forming a plurality of vertical fins on the source/drain layer; forming protective spacers on each of the plurality of vertical fins, forming a sacrificial plug between two protective spacers, forming a filler layer on the protective spacers not in contact with the sacrificial plug, and selectively removing the sacrificial plug to form an isolation region trench between the two protective spacers.
Public/Granted literature
- US20200168511A1 FABRICATION OF A PAIR OF VERTICAL FIN FIELD EFFECT TRANSISTORS HAVING A MERGED TOP SOURCE/DRAIN Public/Granted day:2020-05-28
Information query
IPC分类: