Invention Grant
- Patent Title: Channel bonding and bonded channel access
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Application No.: US17032610Application Date: 2020-09-25
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Publication No.: US10965524B2Publication Date: 2021-03-30
- Inventor: Bahareh Sadeghi , Thomas J. Kenney , Laurent Cariou , Ehud Reshef , Ofer Hareuveni
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04L12/24
- IPC: H04L12/24 ; H04W72/04 ; H04L12/26 ; H04L27/26 ; H04L29/08 ; H04W84/12

Abstract:
Apparatuses, methods, and computer readable media for channel bonding and bonded channel access. The apparatus comprising processing circuitry configured to: gain access to a first 10 MHz channel and to a second 10 MHz channel, and encode a physical layer (PHY) protocol data unit (PPDU) for transmission over a bonded channel, the bonded channel comprising the first 10 MHz channel and the second 10 MHz channel, where the PPDU is encoded to comprise a legacy preamble portion to be transmitted on the first 10 MHz channel and a repeated legacy preamble portion to be transmitted on the second 10 MHz channel, the PPDU further including a non-legacy portion, the non-legacy portion comprising a non-legacy signal field indicating a modulation and coding scheme (MCS) used to encode a data portion of the non-legacy portion, the data portion to be transmitted on the bonded channel.
Public/Granted literature
- US20210014112A1 CHANNEL BONDING AND BONDED CHANNEL ACCESS Public/Granted day:2021-01-14
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