Invention Grant
- Patent Title: Memory circuit and semiconductor device
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Application No.: US16548808Application Date: 2019-08-22
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Publication No.: US10978150B2Publication Date: 2021-04-13
- Inventor: Masaru Yano
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: JPJP2018-206352 20181101
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C14/00 ; G11C11/16

Abstract:
A memory circuit and a semiconductor device are provided. The memory circuit has a function of recovering data when power is suddenly shutdown. The memory device includes a bi-stable circuit capable of holding complementary data respectively at nodes N1 and N2; a first non-volatile memory circuit, connected to the node; and a second non-volatile memory circuit connected to the node. The first non-volatile memory circuit stores boot data, and the second non-volatile memory circuit inverts a logic level of the data held at the second node when the second non-volatile memory circuit stores data at the second node.
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