Invention Grant
- Patent Title: Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
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Application No.: US16168927Application Date: 2018-10-24
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Publication No.: US10986735B2Publication Date: 2021-04-20
- Inventor: Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
- Applicant: TactoTek Oy
- Applicant Address: FI Oulunsalo
- Assignee: TactoTek Oy
- Current Assignee: TactoTek Oy
- Current Assignee Address: FI Oulunsalo
- Agency: Carter, DeLuca & Farrell LLP
- Agent Robert P. Michal, Esq.
- Main IPC: H05K3/00
- IPC: H05K3/00 ; B29C45/14 ; H05K1/02 ; H05K1/03 ; B29L31/34

Abstract:
A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.
Public/Granted literature
- US20190098763A1 APPARATUS FOR CARRYING OUT A MANUFACTURING METHOD ON AN ELECTRO CHEMICAL STRUCTURE Public/Granted day:2019-03-28
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