A composition for a protective film for electroconductive patterns, including: (A) a polyurethane containing a carboxyl group; (B) an epoxy compound; (C) a curing accelerator; and (D) a solvent, wherein the percentage of the solvent (D) contained is from 95.0% to 99.9% by mass, and the solvent (D) contains (D1) a solvent containing a hydroxyl group and having a boiling point in excess of 100° C., and (D2) a solvent having a boiling point that does not exceed 100° C., wherein the content of the solvent (D2) having a boiling point that does not exceed 100° C. is 30% to less than 70% by mass of total solvent in total. The composition can be cured by heating at a temperature not exceeding 100° C. for a heating time not exceeding 10 minutes.