Described is an apparatus which comprises: a die with a first side; a first set of solder balls coupled to the die along the first side; a laminate based substrate adjacent to the first set of solder balls, the laminate based substrate having at least one balun, at least one bandpass filter (BPF), and at least one diplexer embedded in the laminate, wherein the at least one balun is communicatively coupled to the first die via at least one of the solder balls of the first set.