According to one embodiment, the present invention relates to a printed circuit board, comprising: a first insulating layer; an inner layer circuit pattern disposed on an upper surface of the first insulating layer; a second insulating layer, disposed on the first insulating layer, for covering the inner layer circuit pattern; a first outer layer circuit pattern integrated into a lower surface of the first insulating layer; and a second outer layer circuit pattern embedded in an upper surface of the second insulating layer, the first insulating layer comprising a thermosetting resin, and the second insulating layer comprising a photocurable resin.