公开(公告)号：US11026327B2

公开(公告)日：2021-06-01

申请号：US16634698

申请日：2018-07-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Heun Gun Shin

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/42 ,  H05K3/46

Abstract: According to one embodiment, the present invention relates to a printed circuit board, comprising: a first insulating layer; an inner layer circuit pattern disposed on an upper surface of the first insulating layer; a second insulating layer, disposed on the first insulating layer, for covering the inner layer circuit pattern; a first outer layer circuit pattern integrated into a lower surface of the first insulating layer; and a second outer layer circuit pattern embedded in an upper surface of the second insulating layer, the first insulating layer comprising a thermosetting resin, and the second insulating layer comprising a photocurable resin.

公开(公告)号：US09801275B2

公开(公告)日：2017-10-24

申请号：US14621998

申请日：2015-02-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Chung Sik Park ,  Jae Hwa Kim ,  Heun Gun Shin

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K1/113 ,  H05K1/0206 ,  H05K3/0044 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/09854 ,  Y10T29/49155

Abstract: A printed circuit board according to the embodiment includes an insulating layer; a first pad on a top surface of the insulating layer; a second pad on a bottom surface of the insulating layer; and a via formed in the insulating layer and having one surface connected to the first pad and an opposite surface connected to the second pad, wherein the via includes a plurality of via parts which are at least partially overlapped with each other.