Invention Grant
- Patent Title: Electroplating composition and electroplating method
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Application No.: US16226620Application Date: 2018-12-19
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Publication No.: US11035050B2Publication Date: 2021-06-15
- Inventor: Jong Cheol Yun , Wan Joong Kim , Hee Jeong Ryu , Seung Min Park
- Applicant: SOULBRAIN CO., LTD.
- Applicant Address: KR Seongnam-si
- Assignee: SOULBRAIN CO., LTD.
- Current Assignee: SOULBRAIN CO., LTD.
- Current Assignee Address: KR Seongnam-si
- Agent Jongkook Park
- Priority: KR10-2018-0126478 20181023,KR10-2018-0159597 20181212
- Main IPC: C25D3/02
- IPC: C25D3/02 ; C25D3/38 ; C07D473/38 ; C07D239/48 ; C07D239/58
Abstract:
The present invention relates to a electroplating composition and an electroplating method using the same. The electroplating composition of the present invention comprising a first leveling agent and a second leveling agent, wherein the first leveling agent and the second leveling agent each, independently, comprise a compound represented by Chemical Formula 1 below:
Information query
