Invention Grant
- Patent Title: Thermal imaging for identifying a defect in a material
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Application No.: US16830131Application Date: 2020-03-25
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Publication No.: US11039089B2Publication Date: 2021-06-15
- Inventor: Ravibabu Mulaveesala , Vanita Arora , Geetika Dua
- Applicant: INDIAN INSTITUTE OF TECHNOLOGY ROPAR
- Applicant Address: IN Punjab
- Assignee: INDIAN INSTITUTE OF TECHNOLOGY ROPAR
- Current Assignee: INDIAN INSTITUTE OF TECHNOLOGY ROPAR
- Current Assignee Address: IN Punjab
- Agency: Nguyen Tarbet LLC
- Priority: IN201911012086 20190327
- Main IPC: C12Q1/686
- IPC: C12Q1/686 ; H04N5/33 ; G01J5/04 ; G01J5/00

Abstract:
The present subject matter proposes a novel pulse compression favourable non-periodic thermal wave imaging that enhance the energy concentration capabilities and defect detection sensitivity and resolution in comparison with presently used pulse compression favourable thermal wave imaging approaches. This is due to most of the supplied energy is concentrated in the main lobe and very less energy will be redistributed to side lobes by the proposed Complimentary Golay coded excited thermal wave imaging.
Public/Granted literature
- US20200314357A1 THERMAL IMAGING FOR IDENTIFYING A DEFECT IN A MATERIAL Public/Granted day:2020-10-01
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