公开(公告)号：US20250123149A1

公开(公告)日：2025-04-17

申请号：US19002742

申请日：2024-12-27

Applicant: PIXART IMAGING INC.

Inventor： CHIH-MING SUN ,  MING-HAN TSAI ,  CHENG-NAN TSAI

IPC: G01J5/02 ,  B81B7/00 ,  G01J5/04 ,  G01J5/06 ,  H04N5/33 ,  H04N23/57

Abstract: A handheld electronic product includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the handheld electronic product. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.

公开(公告)号：US12274903B2

公开(公告)日：2025-04-15

申请号：US18402258

申请日：2024-01-02

Applicant: HOCHIKI Corporation

Inventor： Yasuharu Fujiwara ,  Isao Saeki ,  Hideki Takano

IPC: G01J5/00 ,  A62C37/36 ,  G01J5/04 ,  G01N21/53

Abstract: A fire detection apparatus 1A includes a heat detection unit 110A provided such that a part of the heat detection unit 110A is accommodated in an outer cover 20A and another part of the heat detection unit 110A is exposed to an outside of the fire detection apparatus 1A through an insertion hole 120A formed in a top surface portion 22A, and a guard portion 130A which is provided to cover a periphery of the insertion hole 120A and another part of the heat detection unit 110A in the top surface portion 22A and has a plurality of ribs, in which a material of a rib corresponding to a first guard side rib 131A among the plurality of ribs is made different from a material of some other ribs, or a shape of the first guard side rib 131A among the plurality of ribs is made different from a shape of some other ribs.

公开(公告)号：US12251193B2

公开(公告)日：2025-03-18

申请号：US17692159

申请日：2022-03-10

Applicant: National Tsing Hua University

Inventor： Wei-Chih Wang ,  Karthikraj Muthuramalingam ,  Fiona Marie Wang

IPC: A61B5/00 ,  A61B5/0507 ,  G01J5/04 ,  G01J5/00

Abstract: Provided is a simple, portable, real-time, and in vivo THz imaging device for imaging a target, e.g., a tooth in the subject. Moreover, the scanning based THz imaging device is much sufficiently sensitive as compared with the common X-ray imaging device. Therefore, the scanning based THz imaging device has the potential to operate in the density for early detection problems such as dental caries or demineralization of the enamel in the teeth. Also provided is a method for diagnosing or imaging the target in the subject by using the scanning based THz imaging device of the present disclosure.

公开(公告)号：US20250076122A1

公开(公告)日：2025-03-06

申请号：US18239185

申请日：2023-08-29

Applicant: X DEVELOPMENT LLC

Inventor： Artsem Artsemenka ,  Phillip Yee ,  Carl Turner ,  Russell Shikami

IPC: G01J5/02 ,  G01J5/04 ,  G01J5/24

Abstract: A device includes a casing, circuitry within the casing, and a temperature sensor. The temperature sensor is connected to the circuitry and is attached to the casing in such a way that an air gap separates the temperature sensor from the casing. The temperature sensor is attached to the casing in a bridge. The bridge includes a first backing and a second backing, which includes a grommet. The temperature sensor is positioned between a portion of the first backing and a portion of the second backing, and includes a flex lead that is electrically connected through the grommet of the second backing to the circuitry inside the casing.

公开(公告)号：US12235163B2

公开(公告)日：2025-02-25

申请号：US18207850

申请日：2023-06-09

Applicant: Google LLC

Inventor： Anthony M. Fadell ,  Matthew L. Rogers ,  Yoky Matsuoka ,  David Sloo ,  Maxime Veron ,  Isabel I. Guenette ,  Shigefumi Honjo

IPC: G01J5/0806 ,  G01J5/02 ,  G01J5/04 ,  G06V40/10 ,  G08B13/193 ,  G08B17/00 ,  G08B17/10 ,  G08B17/11 ,  G08B17/113 ,  H01H9/02 ,  H02J3/00 ,  H02J13/00 ,  H04L12/28 ,  H05B47/19 ,  H05B47/195

Abstract: This application is directed to a home monitoring and control system including a doorbell installed at a door of a home. The doorbell has a button configured to, upon being pressed, wirelessly initiate a first communication to indicate presence of a person at the door. The doorbell also has a camera configured to capture video data within a field of view, and a processor configured to cause a communication component to enable the first communication and wirelessly stream via a remote server the video data captured by the camera to a monitoring device associated with an occupant of the home.

公开(公告)号：US12174134B2

公开(公告)日：2024-12-24

申请号：US16990450

申请日：2020-08-11

Applicant: ABB Schweiz AG

Inventor： Tomas Kozel ,  Gregory Rossano ,  Jianjun Wang

IPC: G01N25/72 ,  G01J5/00 ,  G01J5/02 ,  G01J5/04 ,  G01J5/48

Abstract: A thermographic inspection system is provided for inspecting electrical equipment. The system may be used while the electrical equipment is energized to monitor active performance of the equipment. The system may be used to monitor temperature differences of various components in the equipment.

公开(公告)号：US12163844B2

公开(公告)日：2024-12-10

申请号：US17523391

申请日：2021-11-10

Applicant: RAYTHEON COMPANY

Inventor： Jehyuk Rhee ,  Matthew C. Thomas ,  Henry Lee

IPC: G01J5/24 ,  G01J5/00 ,  G01J5/04

Abstract: A LADOR circuit is in signal communication with a pixel array. The LADOR circuit is configured to generate an integrator reset voltage based on a resistance of the at least one heated bolometer pixel, and to detect laser energy incident on the at least one heated bolometer pixel based on a comparison between the integrator reset voltage and an input threshold voltage (Vthreshold).

公开(公告)号：US20240388824A1

公开(公告)日：2024-11-21

申请号：US18320889

申请日：2023-05-19

Applicant: Jin-Shown SHIE ,  Precision Sensors Design Inc.

Inventor： Jin-Shown SHIE ,  Ou-Chi CHEN ,  Tai-Yan KAM ,  Ko-Ping CHUNG

IPC: H04R1/02 ,  G01J5/00 ,  G01J5/04 ,  G01J5/0802 ,  G01J5/0818 ,  H04R1/10

Abstract: An earbud includes a housing, a thermometer module and a speaker module. The housing defines a passageway having a passageway opening. The thermometer module is disposed in the housing, and receives infrared radiation from an eardrum via the passageway. The speaker module is disposed in the housing, and is operable to generate sound waves that travel through the passageway toward the eardrum. The speaker module cooperates with the housing and the thermometer module to define an infrared radiation path and a sound wave path within the passageway that are separated from each other and that are for the infrared radiation from the eardrum and the sound waves generated by the speaker module to respectively travel therethrough.

公开(公告)号：US20240377260A1

公开(公告)日：2024-11-14

申请号：US18632362

申请日：2024-04-11

Applicant: LSI Industries, Inc.

Inventor： Mark Curtis Reed

IPC: G01J5/04 ,  G01J5/0806

Abstract: An infrared sensor assembly for adjusting a light output of a light source is provided. The infrared sensor assembly is configured to be mounted to a substrate and includes a housing that defines a chamber in which an infrared sensor is located. The housing includes a body and a tubular connector projecting from the body. The tubular connector includes at least one external thread that extends proximate to a free open end of the tubular connector. The infrared sensor assembly includes a lens or a lens assembly threadably attached to the tubular connector. The lens or the lens assembly includes a base with an annular groove. The infrared sensor assembly further includes a gasket received within the annular groove of the lens or the lens assembly and an internally threaded locking ring that is configured to be threadably received by the tubular connector to secure the infrared sensor assembly to the substrate. The substrate is configured to be positioned between the threaded locking ring and the lens or the lens housing such that the gasket is compressed between the substrate and the lens or the lens housing to form a seal therebetween.

公开(公告)号：US12085451B2

公开(公告)日：2024-09-10

申请号：US17326289

申请日：2021-05-20

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Wen-Chie Huang ,  Yu-Chih Liang ,  Chein-Hsun Wang ,  Ming Le ,  Chen-Tang Huang ,  Chein-Hsing Yu ,  Tung-Yang Lee ,  Jenping Ku

IPC: G01J5/16 ,  G01J5/04 ,  G01J5/0806

CPC classification number: G01J5/16 ,  G01J5/0806 ,  G01J5/049

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.