Invention Grant
- Patent Title: Thermal leveling
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Application No.: US16296891Application Date: 2019-03-08
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Publication No.: US11042208B2Publication Date: 2021-06-22
- Inventor: Reshmi Basu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G06F9/50
- IPC: G06F9/50 ; G06F1/3234 ; G06F1/3225

Abstract:
Systems, apparatuses, and methods related to thermal leveling are described. Thermal leveling can be performed on a host computing system as opposed to on a memory system. Thermal leveling can include operations performed by a host to control temperature characteristics and/or power consumption of a memory system. For instance, a host computing system can control temperature characteristics of multiple memory devices that are deployed in a memory system. In an example, a set of processing resources (e.g., a thermal leveling component) can be provided on a host. The set of processing resources can receive information corresponding to thermal characteristics of a memory device coupled to the host and control a thermal setting for the memory device based on the received thermal characteristics.
Public/Granted literature
- US20200285298A1 THERMAL LEVELING Public/Granted day:2020-09-10
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