Invention Grant
- Patent Title: Semiconductor device and fabricating method thereof
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Application No.: US16655252Application Date: 2019-10-17
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Publication No.: US11043584B2Publication Date: 2021-06-22
- Inventor: Chun-Ming Chang , Wen-Jung Liao
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201910862579.5 20190912
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L29/06

Abstract:
A semiconductor device includes an enhancement mode high electron mobility transistor (HEMT) with an active region and an isolation region. The HEMT includes a substrate, a group III-V body layer, a group III-V barrier layer and a recess. The group III-V body layer is disposed on the substrate. The group III-V barrier layer is disposed on the group III-V body layer in the active region and the isolation region. The recess is disposed in the group III-V barrier layer in the active region.
Public/Granted literature
- US20210083084A1 SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF Public/Granted day:2021-03-18
Information query
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