Invention Grant
- Patent Title: Dense memory arrays utilizing access transistors with back-side contacts
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Application No.: US16724691Application Date: 2019-12-23
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Publication No.: US11056492B1Publication Date: 2021-07-06
- Inventor: Wilfred Gomes , Mauro J. Kobrinsky , Elliot Tan , Szuya S. Liao , Tahir Ghani , Swaminathan Sivakumar , Rajesh Kumar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: G11C11/34
- IPC: G11C11/34 ; H01L27/108 ; G11C5/04 ; G11C5/10 ; G11C11/402

Abstract:
Described herein are memory arrays where some memory cells include access transistors with one front-side and one back-side source/drain (S/D) contacts. An example memory array further includes a bitline, coupled to the first S/D region of the access transistor of a first memory cell of the memory array, and a plateline, coupled to a first capacitor electrode of a storage capacitor of the first memory cell. Because the access transistor is a transistor with one front-side and one back-side S/D contacts, the bitline may be provided in a first layer, the channel material—in a second layer, and the plateline—in a third layer, where the second layer is between the first layer and the third layer, which may allow increasing the density of memory cells in a memory array, or, conversely, reducing the footprint area of a memory array with a given density of memory cells.
Public/Granted literature
- US20210193666A1 DENSE MEMORY ARRAYS UTILIZING ACCESS TRANSISTORS WITH BACK-SIDE CONTACTS Public/Granted day:2021-06-24
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