Invention Grant
- Patent Title: Adjustable hyperspectral detection chip enhanced by multi-resonance plasmonic mechanism
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Application No.: US16975400Application Date: 2018-05-28
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Publication No.: US11060916B2Publication Date: 2021-07-13
- Inventor: Tong Zhang , Dan Su , Meng Xiong , Feng Shan , Xiaoyang Zhang
- Applicant: Southeast University
- Applicant Address: CN Jiangsu
- Assignee: Southeast University
- Current Assignee: Southeast University
- Current Assignee Address: CN Jiangsu
- Agency: JCIP Global Inc.
- Priority: CN201810171259.0 20180301
- International Application: PCT/CN2018/088736 WO 20180528
- International Announcement: WO2019/165713 WO 20190906
- Main IPC: G01J3/447
- IPC: G01J3/447 ; G01J3/28 ; H01L27/146 ; H01L31/0232 ; H01L31/0352 ; H01L31/101

Abstract:
An adjustable hyperspectral detection chip enhanced by a multi-resonance plasmonic mechanism. The detection chip consists of an array of metal nanonail resonator detection units. Each detection unit (1) comprises: a bottom electrode (2), a semiconductor material layer (3), a spacer layer (4), a nanonail array (5), a control material layer (6), a top electrode (7), a peripheral control signal (8), and a driving circuit (9). The positional relationship from top to bottom is the top electrode (7), the control material layer (6), the nanonail array (5), the spacer layer (4), the semiconductor material layer (3), and the bottom electrode (2). The nanonail array (5) is loaded inside the control material layer (6), and the peripheral control signal (8) and the driving circuit (9) are connected to both sides of the control material layer (6).
Public/Granted literature
- US20210033462A1 ADJUSTABLE HYPERSPECTRAL DETECTION CHIP ENHANCED BY MULTI-RESONANCE PLASMONIC MECHANISM Public/Granted day:2021-02-04
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