Invention Grant
- Patent Title: Pressure sensor die attach
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Application No.: US16724166Application Date: 2019-12-20
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Publication No.: US11060929B2Publication Date: 2021-07-13
- Inventor: Keyanoush Razavidinani , Gertjan van Sprakelaar , Chris Wagner
- Applicant: Silicon Microstructures, Inc.
- Applicant Address: US CA Milpitas
- Assignee: Silicon Microstructures, Inc.
- Current Assignee: Silicon Microstructures, Inc.
- Current Assignee Address: US CA Milpitas
- Main IPC: G01L1/22
- IPC: G01L1/22

Abstract:
Pressure sensor systems and methods of assembling pressure sensor systems that reduce the need for accurate placement of a pressure sensor die in a pressure sensor package, reduce leakage in pressure sensor systems, and provides a consistent attachment of a pressure sensor die to a package.
Public/Granted literature
- US20200284668A1 PRESSURE SENSOR DIE ATTACH Public/Granted day:2020-09-10
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