Invention Grant
- Patent Title: Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
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Application No.: US16591378Application Date: 2019-10-02
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Publication No.: US11069606B2Publication Date: 2021-07-20
- Inventor: Kelvin Po Leung Pun , Chee Wah Cheung
- Applicant: Compass Technology Company Limited
- Applicant Address: HK Shatin
- Assignee: Compass Technology Company Limited
- Current Assignee: Compass Technology Company Limited
- Current Assignee Address: HK Shatin
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman; Rosemary L. S. Pike
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L25/16 ; H01L21/48 ; H01L23/538 ; H01L25/00
Abstract:
A method to produce a semiconductor package or system-on-flex package comprising bonding structures for connecting IC/chips to fine pitch circuitry using a solid state diffusion bonding is disclosed. A plurality of traces is formed on a substrate, each respective trace comprising at least four different conductive materials having different melting points and plastic deformation properties, which are optimized for both diffusion bonding of chips and soldering of passives components.
Public/Granted literature
Information query
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