Invention Grant
- Patent Title: Construction of three-dimensional profiles of high aspect ratio structures using top down imaging
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Application No.: US16872611Application Date: 2020-05-12
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Publication No.: US11092433B2Publication Date: 2021-08-17
- Inventor: Pradeep Subrahmanyan
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: G01B15/04
- IPC: G01B15/04 ; H01J37/28 ; G06K9/46 ; G06K9/42

Abstract:
The methods and systems disclosed here detect edges of top-down images of respective cross-sections of an array of high-aspect-ratio (HAR) features. The respective cross sections are at various depths of a HAR feature along a longitudinal direction. The detected edges are re-sampled in a spatial domain at a target angular resolution. The re-sampled edges are represented as a corresponding set of harmonics in a frequency domain, each set of harmonics preserving characteristic information about a respective cross-section of the HAR feature at a certain depth. A plurality of cross-sections at the various depths of the HAR feature are reconstructed by analyzing the corresponding sets of harmonics in the frequency domain. A 3D profile of the HAR feature is generated by stitching the plurality of re-constructed cross-sections at the various depths of the HAR feature.
Public/Granted literature
- US20200271442A1 CONSTRUCTION OF THREE-DIMENSIONAL PROFILES OF HIGH ASPECT RATIO STRUCTURES USING TOP DOWN IMAGING Public/Granted day:2020-08-27
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