Invention Grant
- Patent Title: Micromechanical redundant piezoresistive array pressure sensor
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Application No.: US16418719Application Date: 2019-05-21
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Publication No.: US11092504B2Publication Date: 2021-08-17
- Inventor: Michael Robert Daup , David P. Potasek
- Applicant: Rosemount Aerospace Inc.
- Applicant Address: US MN Burnsville
- Assignee: Rosemount Aerospace Inc.
- Current Assignee: Rosemount Aerospace Inc.
- Current Assignee Address: US MN Burnsville
- Agency: Kinney & Lange, P.A.
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G01L9/06 ; H01C1/16

Abstract:
A micromechanical piezoresistive pressure sensor includes a diaphragm configured to mechanically deform in response to an applied load, a sensor substrate located on the diaphragm, and a number of piezoresistive resistance devices located on the sensor substrate. The piezoresistive resistance devices are arranged in a first planar array defining a grid pattern having two or more rows, each row being aligned in a first direction. The piezoresistive resistance devices are configured to be electrically connected in a number of bridge circuits, whereby the piezoresistive resistance devices in each row is electrically connected in an associated bridge circuit. A method of using the micromechanical piezoresistive pressure sensor is also disclosed.
Public/Granted literature
- US20200370981A1 MICROMECHANICAL REDUNDANT PIEZORESISTIVE ARRAY PRESSURE SENSOR Public/Granted day:2020-11-26
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