Invention Grant
- Patent Title: Flip-chip like integrated passive prepackage for SIP device
-
Application No.: US15777810Application Date: 2015-12-25
-
Publication No.: US11101254B2Publication Date: 2021-08-24
- Inventor: Zhicheng Ding , Bin Liu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/CN2015/098867 WO 20151225
- International Announcement: WO2017/107174 WO 20170629
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L21/66 ; H01L23/00 ; H01L25/18 ; H01L25/00 ; H01L25/065
Abstract:
A system in package and method for making a system in package. A plurality of passive devices are coupled to an interposer. A molding compound envelopes the plurality of passive devices and defines a platform having a substantially planar surface. The interposer is coupled to a substrate. A plurality of integrated circuit dies are coupled in a stack to the planar surface.
Public/Granted literature
- US20180374835A1 FLIP-CHIP LIKE INTEGRATED PASSIVE PREPACKAGE FOR SIP DEVICE Public/Granted day:2018-12-27
Information query
IPC分类:
