Invention Grant
- Patent Title: Substrate chucking and dechucking methods
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Application No.: US16293437Application Date: 2019-03-05
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Publication No.: US11114326B2Publication Date: 2021-09-07
- Inventor: Wendell Glenn Boyd, Jr. , Jim Zhongyi He , Ramesh Gopalan , Robert T. Hirahara , Govinda Raj
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01J37/32
Abstract:
Methods for chucking and de-chucking a substrate from an electrostatic chucking (ESC) substrate support to reduce scratches of the non-active surface of a substrate include simultaneously increasing a voltage applied to a chucking electrode embedded in the ESC substrate support and a backside gas pressure in a backside volume disposed between the substrate and the substrate support to chuck the substrate and reversing the process to de-chuck the substrate.
Public/Granted literature
- US20190206712A1 SUBSTRATE CHUCKING AND DECHUCKING METHODS Public/Granted day:2019-07-04
Information query
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