Invention Grant
- Patent Title: Thin film transistors having relatively increased width and shared bitlines
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Application No.: US16633559Application Date: 2017-09-26
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Publication No.: US11114471B2Publication Date: 2021-09-07
- Inventor: Brian S. Doyle , Abhishek A. Sharma , Ravi Pillarisetty , Prashant Majhi , Elijah V. Karpov
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- International Application: PCT/US2017/053424 WO 20170926
- International Announcement: WO2019/066774 WO 20190404
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L29/00 ; H01L21/00 ; H01L27/12 ; H01L21/027 ; H01L21/768 ; H01L29/08 ; H01L29/417 ; H01L29/66 ; H01L29/786

Abstract:
Thin film transistors having relatively increased width and shared bitlines are described. In an example, an integrated circuit structure includes a plurality of transistors formed in an insulator structure above a substrate. The plurality of transistors arranged in a column such that the respective lateral arrangement of the source, the gate, and the drain of each of the transistors aligns with an adjacent thin film transistor, wherein the plurality transistors extend vertically through the insulator structure at least two interconnect levels to provide increased relative width. A first conductive contact is formed between one of sources and drains of at least two of the plurality of transistors in the column, and the conductive contact extends through the insulator structure at least two interconnect levels.
Public/Granted literature
- US20200212075A1 THIN FILM TRANSISTORS HAVING RELATIVELY INCREASED WIDTH AND SHARED BITLINES Public/Granted day:2020-07-02
Information query
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