Invention Grant
- Patent Title: Method for measuring hole provided in workpiece
-
Application No.: US16837597Application Date: 2020-04-01
-
Publication No.: US11120545B2Publication Date: 2021-09-14
- Inventor: Chun-Yi Lee , Tsai-Ling Kao , Hian-Kun Tenn
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Priority: TW108146346 20191218
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/149 ; G01B5/12

Abstract:
A method for measuring a hole provided in a workpiece is provided and the method comprises: obtaining a three-dimensional point cloud model of the workpiece and a two-dimensional image of the workpiece, defining a first contour in the three-dimensional point cloud model based on an intensity difference of the two-dimensional image, defining a second contour and a third contour respectively based in the first contour, bounding a data point testing region between the second contour and the third contour, respectively defining data point sampling regions along a plurality of cross-section directions of the data point testing region, respectively sampling data points in the data point sampling regions to obtain a turning point set comprising turning points, wherein each of the turning points has the largest turning margin, connecting the turning points which are distributed in the turning point set along a ring direction to obtain an edge of the hole.
Public/Granted literature
- US20210192705A1 METHOD FOR MEASURING HOLE PROVIDED IN WORKPIECE Public/Granted day:2021-06-24
Information query