Invention Grant
- Patent Title: Interposer and electronic device
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Application No.: US16861731Application Date: 2020-04-29
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Publication No.: US11145586B2Publication Date: 2021-10-12
- Inventor: Kanto Iida , Hiromasa Koyama
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2017-211580 20171101
- Main IPC: H01L23/498
- IPC: H01L23/498

Abstract:
An interposer includes a stacked body including insulating base material layers that are stacked on one another, first and second electrodes, a conductor pattern, and an interlayer connection conductor. The stacked body includes a first mounting surface including a first electrode, and a second mounting surface facing the first mounting surface and including a second electrode. The first electrode is electrically connected to the second electrode through the conductor pattern and the interlayer connection conductor. A length of an electrical path including conductor patterns connecting the first electrode and the second electrode is larger than a total length of the interlayer connection conductor in a stacking direction.
Public/Granted literature
- US20200258828A1 INTERPOSER AND ELECTRONIC DEVICE Public/Granted day:2020-08-13
Information query
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