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    Multilayer board and manufacturing method thereof
    1.
    发明授权
    Multilayer board and manufacturing method thereof 有权

    公开(公告)号：US11456108B2

    公开(公告)日：2022-09-27

    申请号：US16374769

    申请日：2019-04-04

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kanto Iida

    IPC: H01F27/28 ,  H01F27/32 ,  H01F41/12 ,  H01F27/29 ,  H01F41/04 ,  H05K3/46 ,  H05K1/16 ,  H01F17/00

    Abstract: A multilayer board includes a first substrate made of a thermoplastic resin, a first conductor pattern provided on the first substrate, a second substrate made of the thermoplastic resin, and a second conductor pattern provided on the second substrate. An insulation coating which covers the first conductor pattern is partially disposed between the first substrate and the second substrate. The insulation coating is made of a material having lower fluidity at a predetermined press temperature than fluidities of the first substrate and the second substrate, and a plurality of substrates including the first substrate and the second substrate are laminated and thermally compressed and bonded at the press temperature.

    Interposer and electronic device
    2.
    发明授权
    Interposer and electronic device 有权

    公开(公告)号：US10806033B2

    公开(公告)日：2020-10-13

    申请号：US16807307

    申请日：2020-03-03

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kanto Iida ,  Shinichi Araki ,  Ryosuke Takada ,  Takahiro Baba

    IPC: H05K1/14 ,  H05K1/02 ,  H05K3/36

    Abstract: An interposer includes a stacked body including first and second mounting surfaces that face each other, a first electrode on the first mounting surface, and a second electrode on the second mounting surface. The stacked body includes flexible insulating layers stacked on each other, and a folded portion. The first and second electrodes are electrically connected to each other. The stacked body includes an upright portion between the first and second mounting surfaces and in which a stacking direction in which the insulating layers are stacked is parallel to the first and second mounting surfaces, and a bent portion bent in a plan view of the first and second mounting surfaces.

    Interposer and electronic device
    3.
    发明授权
    Interposer and electronic device 有权

    公开(公告)号：US11145586B2

    公开(公告)日：2021-10-12

    申请号：US16861731

    申请日：2020-04-29

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kanto Iida ,  Hiromasa Koyama

    IPC: H01L23/498

    Abstract: An interposer includes a stacked body including insulating base material layers that are stacked on one another, first and second electrodes, a conductor pattern, and an interlayer connection conductor. The stacked body includes a first mounting surface including a first electrode, and a second mounting surface facing the first mounting surface and including a second electrode. The first electrode is electrically connected to the second electrode through the conductor pattern and the interlayer connection conductor. A length of an electrical path including conductor patterns connecting the first electrode and the second electrode is larger than a total length of the interlayer connection conductor in a stacking direction.

    Signal transmission line including a signal conductor and reinforcing conductor portions parallel to the signal conductor
    4.
    发明授权
    Signal transmission line including a signal conductor and reinforcing conductor portions parallel to the signal conductor 审中-公开

    公开(公告)号：US10673114B2

    公开(公告)日：2020-06-02

    申请号：US16022761

    申请日：2018-06-29

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kanto Iida ,  Nobuo Ikemoto

    IPC: H01P3/08 ,  H01P3/00

    Abstract: A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

    Signal transmission line including a flexible resin laminate having interior hollow portions overlapping the signal transmission line
    7.
    发明授权
    Signal transmission line including a flexible resin laminate having interior hollow portions overlapping the signal transmission line 有权

    公开(公告)号：US11251511B2

    公开(公告)日：2022-02-15

    申请号：US16843979

    申请日：2020-04-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kanto Iida ,  Nobuo Ikemoto

    IPC: H01P3/08 ,  H01P3/00

    Abstract: A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

    High-frequency signal transmission line and electronic device
    8.
    发明授权
    High-frequency signal transmission line and electronic device 有权
    高频信号传输线和电子设备

    公开(公告)号：US09401531B2

    公开(公告)日：2016-07-26

    申请号：US14191595

    申请日：2014-02-27

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kanto Iida ,  Shigeru Tago

    IPC: H01P3/08 ,  H03H7/38 ,  H05K1/02

    CPC classification number: H01P3/08 ,  H03H7/38 ,  H05K1/0225 ,  H05K1/0253 ,  H05K2201/09327 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/09727

    Abstract: A high-frequency signal transmission line includes a dielectric body including a plurality of dielectric sheets. A signal line is provided in the dielectric body. A connector is mounted on a first main surface of the dielectric body and electrically connected to the signal line. A ground conductor is provided on a second main surface side of the dielectric body, compared with the signal line, and faces the signal line across the dielectric sheet. In the ground conductor, conductor-missing portions are provided in which no conductors are provided in at least portions of regions overlapping with the signal line in planar in connection portions. Adjustment conductors are provided in the second main surface of the dielectric body, and overlap with at least portions of the conductor-missing portions in the planar view.

    Abstract translation: 高频信号传输线包括包括多个电介质片的电介体。 信号线设置在电介质体中。 连接器安装在电介质体的第一主表面上并电连接到信号线。 与信号线相比，在电介质体的第二主表面侧设置接地导体，并且面对跨越电介质片的信号线。 在接地导体中，提供导体缺失部分，其中在与连接部分中平面的信号线重叠的区域的至少部分中不设置导体。 调整导体设置在电介质体的第二主表面中，并且在俯视图中与导体缺失部分的至少一部分重叠。

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