Invention Grant
- Patent Title: System, apparatus and method for multi-die distributed memory mapped input/output support
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Application No.: US16447025Application Date: 2019-06-20
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Publication No.: US11157431B2Publication Date: 2021-10-26
- Inventor: Bryan R. White , Aravindh Anantaraman , Ankur Shah , Altug Koker , David Puffer , Aditya Navale
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F13/36
- IPC: G06F13/36 ; G06F13/40 ; G06T1/20 ; G06F13/42

Abstract:
In one embodiment, a method includes: receiving, in a root tile of an accelerator device having a plurality of tiles, a message from a processor, the message comprising a register write request to a register of a first remote tile of the plurality of remote tiles; decoding, in an endpoint controller of the root tile, a system address of the message to identify a destination tile for the message, based at least in part on a base address register decode of the system address; and in response to identifying the first remote tile as the destination tile, updating a first portion of an address offset field of the system address to a predetermined value and directing the message to the first remote tile coupled to the root tile via a sideband interconnect. Other embodiments are described and claimed.
Public/Granted literature
- US20190303334A1 System, Apparatus And Method For Multi-Die Distributed Memory Mapped Input/Output Support Public/Granted day:2019-10-03
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