Invention Grant
- Patent Title: Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node
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Application No.: US16245643Application Date: 2019-01-11
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Publication No.: US11166363B2Publication Date: 2021-11-02
- Inventor: Antti Keränen , Tomi Simula , Mikko Heikkinen , Jarmo Sääski , Pasi Raappana , Minna Pirkonen
- Applicant: TACTOTEK OY
- Applicant Address: FI Oulunsalo
- Assignee: TACTOTEK OY
- Current Assignee: TACTOTEK OY
- Current Assignee Address: FI Oulunsalo
- Agency: Carter, DeLuca & Farrell LLP
- Agent Robert P. Michal, Esq.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K5/06 ; H05K3/28

Abstract:
An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
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