- Patent Title: Solder pads of variable thickness in an optoelectronic semiconductor chip, on a connection substrate for mounting a semiconductor chip, method of producing an optoelectronic component, and optoelectronic component having the solder pads
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Application No.: US16348602Application Date: 2017-11-10
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Publication No.: US11177233B2Publication Date: 2021-11-16
- Inventor: Christian Leirer , Martin Rudolf Behringer
- Applicant: OSRAM OLED GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- Priority: DE102016121631.3 20161111
- International Application: PCT/EP2017/078899 WO 20171110
- International Announcement: WO2018/087297 WO 20180517
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/16 ; H01L33/48 ; H01L33/62
Abstract:
An optoelectronic semiconductor chip includes a rear side with a center and with two contact points for electrical contacting of the semiconductor chip, the contact points being spaced apart from one another, and two solder pads arranged on the contact points, wherein the center is located in a region between the contact points, the solder pads protrude from the rear side and are exposed, and on average, the solder pads are thicker further away from the center than in the vicinity of the center or vice versa.
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