Invention Grant
- Patent Title: Data packaging protocols for communications between IoT devices
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Application No.: US16466997Application Date: 2017-12-28
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Publication No.: US11196623B2Publication Date: 2021-12-07
- Inventor: Ned M. Smith , Keith Nolan , Mark Kelly
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight & Zimmerman, LLC
- International Application: PCT/US2017/068830 WO 20171228
- International Announcement: WO2018/126076 WO 20180705
- Main IPC: H04L12/24
- IPC: H04L12/24 ; H04L29/08 ; H04W4/70 ; G06F16/182 ; H04L9/08 ; H04L9/32 ; H04L12/733 ; H04L29/06 ; H04W4/08 ; H04W84/22 ; H04L29/12 ; H04W12/69 ; H04W84/18

Abstract:
An Internet of Things (IoT) network includes an IoT device with a communicator to send a communication including egress frame, protocol library builder to determine available protocols, frame analyzer to analyze an ingress frame, and frame builder to build the egress frame from the ingress frame. An IoT network includes an IoT device with network discoverer to identify available parallel communication channels between IoT device and target device, payload, payload fragmenter/packager to fragment the payload into sub-objects for transmission, and packet communicator to send sub-objects to the target device over parallel communication channels. An IoT network includes a plurality of IoT devices, which each include a communication channel to an upstream device, a network link to another one of the plurality of IoT devices, a hash calculator to identify a neighbor IoT device, and a communicator to send out a message to the neighbor IoT device.
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