Invention Grant
- Patent Title: Memory arrays and methods used in forming a memory array comprising strings of memory cells
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Application No.: US16550238Application Date: 2019-08-25
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Publication No.: US11205654B2Publication Date: 2021-12-21
- Inventor: Yi Hu , Ramey M. Abdelrahaman , Narula Bilik , Daniel Billingsley , Zhenyu Bo , Joan M. Kash , Matthew J. King , Andrew Li , David Neumeyer , Wei Yeeng Ng , Yung K. Pak , Chandra Tiwari , Yiping Wang , Lance Williamson , Xiaosong Zhang
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/11556
- IPC: H01L27/11556 ; H01L27/11524 ; H01L27/11582 ; H01L27/1157

Abstract:
A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Operative channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. Intervening material is laterally-between and longitudinally-along immediately-laterally-adjacent of the memory blocks. The intervening material comprises longitudinally-alternating first and second regions that individually have a vertically-elongated seam therein. The vertically-elongated seam in the first regions are taller than in the second regions. Additional embodiments, including method, are disclosed.
Public/Granted literature
- US20210057428A1 Memory Arrays And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells Public/Granted day:2021-02-25
Information query
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