Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing module, and semiconductor device fabrication method
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Application No.: US17162665Application Date: 2021-01-29
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Publication No.: US11215506B2Publication Date: 2022-01-04
- Inventor: Kyeonghun Kim , Jeongil Mun , Hyung Joo Lee , Jongwoo Sun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2018-0170925 20181227
- Main IPC: G01J3/443
- IPC: G01J3/443 ; H01J37/32 ; G01J3/28

Abstract:
A substrate processing module includes a process chamber configured to perform a treatment process on a substrate; a transfer chamber provided on a first side of the process chamber, the substrate being transferred between the process chamber and the transfer chamber; an optical emission spectroscopy (OES) system provided on a second side of the process chamber and configured to monitor the process chamber; and a reference light source disposed in the transfer chamber and configured to emit a reference light to calibrate the OES system.
Public/Granted literature
- US20210148760A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING MODULE, AND SEMICONDUCTOR DEVICE FABRICATION METHOD Public/Granted day:2021-05-20
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