Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
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Application No.: US16709896Application Date: 2019-12-10
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Publication No.: US11217527B2Publication Date: 2022-01-04
- Inventor: Shu-Ming Li , Chia-Hung Liu , Tzu-Ming Ou Yang
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/311 ; H01L21/768
Abstract:
A semiconductor device and a manufacturing method of the same are provided. The semiconductor device includes a substrate having a plurality of active regions, at least one dielectric layer formed on the substrate, and a plurality of contacts disposed in the dielectric layer and contacting with the active regions. The contact is a barrel-shaped structure with a middle portion, a head portion having a perimeter small than that of the middle portion, and an end portion having a perimeter small than that of the middle portion.
Public/Granted literature
- US20210175169A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2021-06-10
Information query
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