Invention Grant
- Patent Title: Mask blank, phase shift mask, method for manufacturing thereof, and method for manufacturing semiconductor device
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Application No.: US15754927Application Date: 2016-06-20
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Publication No.: US11226549B2Publication Date: 2022-01-18
- Inventor: Osamu Nozawa , Hiroaki Shishido
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2015-170547 20150831
- International Application: PCT/JP2016/068250 WO 20160620
- International Announcement: WO2017/038213 WO 20170309
- Main IPC: G03F1/26
- IPC: G03F1/26 ; G03F1/48 ; G03F1/80 ; G03F1/84 ; H01L21/027

Abstract:
Provided is a mask blank for a phase shift mask having an etching stopper film, which satisfies the characteristics: higher durability to dry etching with fluorine-based gas that is used during the shift pattern formation as compared to that of a transparent substrate; high resistance to chemical cleaning; and high transmittance of exposure light.
The mask blank includes a light shielding film on a main surface of a transparent substrate, having a structure where an etching stopper film, a phase shift film, and a light shielding film are laminated in this order on the transparent substrate; wherein the phase shift film includes a material containing silicon and oxygen; and the etching stopper film includes a material containing silicon, aluminum, and oxygen.
The mask blank includes a light shielding film on a main surface of a transparent substrate, having a structure where an etching stopper film, a phase shift film, and a light shielding film are laminated in this order on the transparent substrate; wherein the phase shift film includes a material containing silicon and oxygen; and the etching stopper film includes a material containing silicon, aluminum, and oxygen.
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