Invention Grant
- Patent Title: Reducing band-to-band tunneling in semiconductor devices
-
Application No.: US16649304Application Date: 2017-11-06
-
Publication No.: US11233148B2Publication Date: 2022-01-25
- Inventor: Benjamin Chu-Kung , Jack T. Kavalieros , Seung Hoon Sung , Siddharth Chouksey , Harold W. Kennel , Dipanjan Basu , Ashish Agrawal , Glenn A. Glass , Tahir Ghani , Anand S. Murthy
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/060113 WO 20171106
- International Announcement: WO2019/089050 WO 20190509
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L21/02 ; H01L29/08 ; H01L29/165 ; H01L29/205 ; H01L29/66

Abstract:
Integrated circuit transistor structures are disclosed that reduce band-to-band tunneling between the channel region and the source/drain region of the transistor, without adversely increasing the extrinsic resistance of the device. In an example embodiment, the structure includes one or more spacer configured to separate the source and/or drain from the channel region. The spacer(s) regions comprise a semiconductor material that provides a relatively high conduction band offset (CBO) and a relatively low valence band offset (VBO) for PMOS devices, and a relatively high VBO and a relatively low CBO for NMOS devices. In some cases, the spacer includes silicon, germanium, and carbon (e.g., for devices having germanium channel). The proportions may be at least 10% silicon by atomic percentage, at least 85% germanium by atomic percentage, and at least 1% carbon by atomic percentage. Other embodiments are implemented with III-V materials.
Public/Granted literature
- US20200266296A1 REDUCING BAND-TO-BAND TUNNELING IN SEMICONDUCTOR DEVICES Public/Granted day:2020-08-20
Information query
IPC分类: