Invention Grant
- Patent Title: Circuit board
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Application No.: US17032244Application Date: 2020-09-25
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Publication No.: US11234328B2Publication Date: 2022-01-25
- Inventor: Chia-En Fan , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
- Applicant: CHIPBOND TECHNOLOGY CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: CHIPBOND TECHNOLOGY CORPORATION
- Current Assignee: CHIPBOND TECHNOLOGY CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Jackson IPG PLLC
- Agent Demian K. Jackson
- Priority: TW109106342 20200226
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11

Abstract:
A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.
Public/Granted literature
- US20210267047A1 CIRCUIT BOARD Public/Granted day:2021-08-26
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