Invention Grant
- Patent Title: Resonant pressure sensor and manufacturing method therefor
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Application No.: US14460684Application Date: 2014-08-15
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Publication No.: US11243131B2Publication Date: 2022-02-08
- Inventor: Takashi Yoshida , Yuusaku Yoshida , Atsushi Yumoto , Yoshitaka Suzuki
- Applicant: YOKOGAWA ELECTRIC CORPORATION
- Applicant Address: JP Musashino
- Assignee: YOKOGAWA ELECTRIC CORPORATION
- Current Assignee: YOKOGAWA ELECTRIC CORPORATION
- Current Assignee Address: JP Musashino
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2013-169638 20130819
- Main IPC: G01L9/08
- IPC: G01L9/08 ; G01L9/12 ; G01L7/08 ; G01L7/02 ; G01L9/00
Abstract:
A resonant pressure sensor includes a first substrate including a diaphragm and at least one projection disposed on the diaphragm, and at least one resonator disposed in the first substrate, at least a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate.
Public/Granted literature
- US20150047434A1 RESONANT PRESSURE SENSOR AND MANUFACTURING METHOD THEREFOR Public/Granted day:2015-02-19
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