Invention Grant
- Patent Title: High voltage transistor structure and method of fabricating the same
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Application No.: US16936442Application Date: 2020-07-23
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Publication No.: US11251279B2Publication Date: 2022-02-15
- Inventor: Zhi-Cheng Lee , Kai-Lin Lee , Wei-Jen Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN202010650267.0 20200708
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/40 ; H01L29/49 ; H01L29/66

Abstract:
A high voltage transistor structure includes a substrate. A metal gate is disposed on the substrate. At least one insulating material structure penetrates the metal gate. A metal compound layer is disposed between the metal gate and the substrate, between the insulating material structure and the substrate. The metal compound layer is a continuous structure. Agate dielectric layer is disposed under the metal compound layer and contacts the substrate.
Public/Granted literature
- US20220013648A1 HIGH VOLTAGE TRANSISTOR STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-01-13
Information query
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