Invention Grant
- Patent Title: Method for producing a thermally conductive polysiloxane composition
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Application No.: US15772690Application Date: 2016-11-02
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Publication No.: US11254849B2Publication Date: 2022-02-22
- Inventor: Eiji Tanigawa , Masanori Takanashi , Isao Iida , Daigo Hirakawa , Kenji Takenaka
- Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
- Applicant Address: JP Tokyo
- Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
- Current Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JPJP2015-217951 20151105
- International Application: PCT/JP2016/082627 WO 20161102
- International Announcement: WO2017/078081 WO 20170511
- Main IPC: C08K9/06
- IPC: C08K9/06 ; C09K5/14 ; H01L23/36 ; C08L83/04 ; H01L23/373 ; C08J3/20 ; C08K9/08 ; C08G77/20 ; C08K3/22 ; C09C3/12
Abstract:
A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.
Public/Granted literature
- US20190161666A1 METHOD FOR PRODUCING A THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION Public/Granted day:2019-05-30
Information query
